Danfoss Bond Buffer®

  • Innovative new technology increases reliability and performance

    In many industrial and automotive applications, reliability and longevity of components is critical. Traditional solutions suffer from limited reliability due to solder layers and aluminium wire bonds. 
By using unique sintering techniques and using copper instead of aluminium wires along with the new Danfoss Bond Buffer™ technology, Danfoss offers outstanding reliability and significant performance.

  • Longer lifetime and higher current density

    The innovative combination of Danfoss' Bond Buffer® technology or the copper layer, cooper wire and sintered joints lead to a much longer lifetime and/or higher current density.

    Other significant advantages include additional thermal capacity, better short circuit performance and lower forward voltages.

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