In many industrial and automotive applications, reliability and longevity of components is critical. Traditional solutions suffer from limited reliability due to solder layers and aluminium wire bonds.
By using unique sintering techniques and using copper instead of aluminium wires along with the new Danfoss Bond Buffer™ technology, Danfoss offers outstanding reliability and significant performance.
The innovative combination of Danfoss' Bond Buffer® technology or the copper layer, cooper wire and sintered joints lead to a much longer lifetime and/or higher current density.
Other significant advantages include additional thermal capacity, better short circuit performance and lower forward voltages.
Danfoss Silicon Power GmbH
Husumer Str. 251
Germany T +49 (0)461 4301 40F +49 (0)461 4301 4310