Our engineers at Danfoss Silicon Power are experienced in working with innovative materials and modern semiconductors. This enables them to minimize the power modules’ while providing the necessary maximum power dissipations.
Danfoss Silicon Power specializes in customized power modules with individual chip assembly and heat sink design. The packaging is also individually designed - to meet your exact requirements.
Our state-of-the-art production equipment automatically packages modules directly from the semiconductor on wafer to the final electric test.
To ensure the highest level of quality, our entire manufacturing process up to the electronic and testing processes take place under clean room conditions.
We welcome customer collaboration with our dedicated teams and encourage you to join us for a tour around our high-tech production facilities.
Are you interested then please contact us.
Danfoss Silicon Power GmbH
Husumer Str. 251
Germany T +49 (0)461 4301 40F +49 (0)461 4301 4310